Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink

Product Description

Product Description
Product Overview 1
Product Overview 2
Product Detail 1
Product Detail 2
Product Performance
Product Dimension Diagram
Performance Test Chart
Structure Detail 1
Structure Detail 2
Structure Detail 3
Specification
Parameter Details
Type CPU radiator
Texture of material Copper base + copper fins
Heat dissipation method Air cooling
Power waste 95W
Packing & Delivery
Packaging Box Option A
Packaging Box Option B
FAQ
Q1: What materials are used to construct this CPU radiator?

A1: This radiator features a high-grade copper base combined with copper fins, providing superior heat conductivity and thermal dissipation performance compared to standard aluminum alternatives.

Q2: What is the primary heat dissipation method for this cooling system?

A2: It utilizes an optimized air-cooling system designed to maximize airflow and efficiently draw heat away from your CPU under load.

Q3: What maximum TDP (Power Waste) can this CPU radiator handle?

A3: This CPU radiator is rated to handle power dissipation up to 95W, which makes it ideal for a wide range of standard desktop processors.

Q4: Is the mounting hardware included in the package?

A4: Yes, our standard packing structure includes the necessary mounting brackets and essential accessories required for a clean and secure installation.

Q5: How is the product packed to prevent damage during shipping?

A5: We package the radiators using protective padding and impact-resistant outer cartons to safeguard the delicate copper fins and base during transit.

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